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7.5
CVSSv2

CVE-2018-5878

Published: 06/07/2018 Updated: 10/09/2018
CVSS v2 Base Score: 7.5 | Impact Score: 6.4 | Exploitability Score: 10
CVSS v3 Base Score: 9.8 | Impact Score: 5.9 | Exploitability Score: 3.9
VMScore: 668
Vector: AV:N/AC:L/Au:N/C:P/I:P/A:P
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Vulnerability Summary

While sending the response to a RIL_REQUEST_GET_SMSC_ADDRESS message, a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear.

Vulnerability Trend

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qualcomm mdm9206_firmware -

qualcomm mdm9607_firmware -

qualcomm mdm9635m_firmware -

qualcomm mdm9650_firmware -

qualcomm sd_210_firmware -

qualcomm sd_212_firmware -

qualcomm sd_205_firmware -

qualcomm sd_615_firmware -

qualcomm sd_616_firmware -

qualcomm sd_415_firmware -

qualcomm sd_625_firmware -

qualcomm sd_835_firmware -

References

CWE-119https://www.qualcomm.com/company/product-security/bulletinshttps://nvd.nist.gov
CVSSv2
CVSSv2
CVSSv3
VMScore
Recommendations:
CVE-2023-47626CVE-2024-3400physicalCVE-2024-31426CVE-2024-22423CVE-2024-22438injectlocal usersCVE-2024-3797
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