7.8
CVSSv3

CVE-2018-11277

Published: 20/09/2018 Updated: 03/10/2019
CVSS v2 Base Score: 4.6 | Impact Score: 6.4 | Exploitability Score: 3.9
CVSS v3 Base Score: 7.8 | Impact Score: 5.9 | Exploitability Score: 1.8
VMScore: 409
Vector: AV:L/AC:L/Au:N/C:P/I:P/A:P

Vulnerability Summary

In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.

Vulnerability Trend

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qualcomm msm8909w firmware -

qualcomm msm8996au firmware -

qualcomm sd210 firmware -

qualcomm sd212 firmware -

qualcomm sd205 firmware -

qualcomm sd430 firmware -

qualcomm sd450 firmware -

qualcomm sd615 firmware -

qualcomm sd616 firmware -

qualcomm sd415 firmware -

qualcomm sd617 firmware -

qualcomm sd625 firmware -

qualcomm sd650 firmware -

qualcomm sd652 firmware -

qualcomm sd810 firmware -

qualcomm sd820 firmware -

qualcomm sd820a firmware -

qualcomm sd835 firmware -

qualcomm sd845 firmware -

qualcomm sda660 firmware -