5.5
CVSSv3

CVE-2015-9218

Published: 18/04/2018 Updated: 02/05/2018
CVSS v2 Base Score: 4.9 | Impact Score: 6.9 | Exploitability Score: 3.9
CVSS v3 Base Score: 5.5 | Impact Score: 3.6 | Exploitability Score: 1.8
VMScore: 436
Vector: AV:L/AC:L/Au:N/C:N/I:N/A:C

Vulnerability Summary

In Android prior to 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 835, SD 845, SDM630, SDM636, SDM660, and Snapdragon_High_Med_2016, when processing bad HEVC clips, the DPB fills, and with no error handling for DPB being full, a hang occurs.

Vulnerable Product Search on Vulmon Subscribe to Product

qualcomm msm8909w_firmware -

qualcomm sd_210_firmware -

qualcomm sd_212_firmware -

qualcomm sd_205_firmware -

qualcomm sd_400_firmware -

qualcomm sd_410_firmware -

qualcomm sd_412_firmware -

qualcomm sd_425_firmware -

qualcomm sd_430_firmware -

qualcomm sd_450_firmware -

qualcomm sd_625_firmware -

qualcomm sd_650_firmware -

qualcomm sd_652_firmware -

qualcomm sd_800_firmware -

qualcomm sd_808_firmware -

qualcomm sd_810_firmware -

qualcomm sd_820_firmware -

qualcomm sd_835_firmware -

qualcomm sd_845_firmware -

qualcomm sdm630_firmware -

qualcomm sdm636_firmware -

qualcomm sd_427_firmware -

qualcomm sd_435_firmware -

qualcomm sdm660_firmware -