CVE-2017-18157

Published: 06/05/2019 Updated: 07/05/2019

CVSS v2 Base Score: 7.2 | Impact Score: 10 | Exploitability Score: 3.9

CVSS v3 Base Score: 7.8 | Impact Score: 5.9 | Exploitability Score: 1.8

VMScore: 641

Vector: AV:L/AC:L/Au:N/C:C/I:C/A:C

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.

Vulnerable Product	Search on Vulmon	Subscribe to Product
qualcomm mdm9206 firmware -
qualcomm mdm9607 firmware -
qualcomm mdm9650 firmware -
qualcomm msm8909w firmware -
qualcomm msm8996au firmware -
qualcomm sd 210 firmware -
qualcomm sd 212 firmware -
qualcomm sd 205 firmware -
qualcomm sd 425 firmware -
qualcomm sd 450 firmware -
qualcomm sd 615 firmware -
qualcomm sd 616 firmware -
qualcomm sd 415 firmware -
qualcomm sd 625 firmware -
qualcomm sd 650 firmware -
qualcomm sd 652 firmware -
qualcomm sd 820 firmware -
qualcomm sd 820a firmware -
qualcomm sd 835 firmware -
qualcomm sd 845 firmware -
qualcomm sdx20 firmware -

CWE-416 https://www.qualcomm.com/company/product-security/bulletins https://nvd.nist.gov

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CVE-2017-18157

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