A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
Vulnerable Product | Search on Vulmon | Subscribe to Product |
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qualcomm mdm9206_firmware - |
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qualcomm mdm9607_firmware - |
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qualcomm mdm9650_firmware - |
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qualcomm msm8909w_firmware - |
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qualcomm msm8996au_firmware - |
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qualcomm sd_210_firmware - |
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qualcomm sd_212_firmware - |
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qualcomm sd_205_firmware - |
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qualcomm sd_425_firmware - |
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qualcomm sd_450_firmware - |
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qualcomm sd_615_firmware - |
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qualcomm sd_616_firmware - |
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qualcomm sd_415_firmware - |
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qualcomm sd_625_firmware - |
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qualcomm sd_650_firmware - |
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qualcomm sd_652_firmware - |
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qualcomm sd_820_firmware - |
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qualcomm sd_820a_firmware - |
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qualcomm sd_835_firmware - |
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qualcomm sd_845_firmware - |
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qualcomm sdx20_firmware - |