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7.8
CVSSv3

CVE-2017-18297

Published: 23/10/2018 Updated: 07/12/2018
CVSS v2 Base Score: 7.2 | Impact Score: 10 | Exploitability Score: 3.9
CVSS v3 Base Score: 7.8 | Impact Score: 5.9 | Exploitability Score: 1.8
VMScore: 641
Vector: AV:L/AC:L/Au:N/C:C/I:C/A:C
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Vulnerability Summary

Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.

Vulnerability Trend

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qualcomm sd_425_firmware -

qualcomm sd_430_firmware -

qualcomm sd_450_firmware -

qualcomm sd_625_firmware -

qualcomm sd_650_firmware -

qualcomm sd_652_firmware -

qualcomm sd_820_firmware -

References

CWE-415https://www.qualcomm.com/company/product-security/bulletinshttps://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-componentshttp://www.securitytracker.com/id/1041432https://nvd.nist.gov
CVSSv3
CVSSv2
CVSSv3
VMScore
Recommendations:
path traversalCVE-2024-26978CVE-2024-26982wirelessCVE-2023-6949CVE-2024-26980CVE-2024-32766CVE-2024-26939cache poisoning
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