10
CVSSv2

CVE-2019-10612

Published: 05/03/2020 Updated: 09/03/2020
CVSS v2 Base Score: 10 | Impact Score: 10 | Exploitability Score: 10
CVSS v3 Base Score: 9.8 | Impact Score: 5.9 | Exploitability Score: 3.9
VMScore: 890
Vector: AV:N/AC:L/Au:N/C:C/I:C/A:C

Vulnerability Summary

UTCB object has a function pointer called by the reaper to deallocate its memory resources and this address can potentially be corrupted by stack overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, MDM9650, QCS605, SA6155P, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130

Vulnerability Trend

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qualcomm mdm9205_firmware -

qualcomm mdm9650_firmware -

qualcomm qcs605_firmware -

qualcomm sa6155p_firmware -

qualcomm sc8180x_firmware -

qualcomm sda845_firmware -

qualcomm sdm670_firmware -

qualcomm sdm710_firmware -

qualcomm sdm845_firmware -

qualcomm sdm850_firmware -

qualcomm sdx55_firmware -

qualcomm sm6150_firmware -

qualcomm sm7150_firmware -

qualcomm sm8150_firmware -

qualcomm sm8250_firmware -

qualcomm sxr1130_firmware -

qualcomm sxr2130_firmware -