4.6
CVSSv2

CVE-2019-14037

Published: 30/07/2020 Updated: 31/07/2020
CVSS v2 Base Score: 4.6 | Impact Score: 6.4 | Exploitability Score: 3.9
CVSS v3 Base Score: 7.8 | Impact Score: 5.9 | Exploitability Score: 1.8
VMScore: 409
Vector: AV:L/AC:L/Au:N/C:P/I:P/A:P

Vulnerability Summary

Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130

Vulnerability Trend

Vulnerable Product Search on Vulmon Subscribe to Product

qualcomm apq8009_firmware -

qualcomm apq8053_firmware -

qualcomm apq8096au_firmware -

qualcomm apq8098_firmware -

qualcomm mdm9206_firmware -

qualcomm mdm9207c_firmware -

qualcomm mdm9607_firmware -

qualcomm mdm9640_firmware -

qualcomm mdm9650_firmware -

qualcomm msm8905_firmware -

qualcomm msm8909w_firmware -

qualcomm msm8996_firmware -

qualcomm msm8996au_firmware -

qualcomm qcn7605_firmware -

qualcomm qcn7606_firmware -

qualcomm qcs605_firmware -

qualcomm sc8180x_firmware -

qualcomm sda660_firmware -

qualcomm sda845_firmware -

qualcomm sdm439_firmware -

qualcomm sdm630_firmware -

qualcomm sdm636_firmware -

qualcomm sdm660_firmware -

qualcomm sdm670_firmware -

qualcomm sdm710_firmware -

qualcomm sdm845_firmware -

qualcomm sdx20_firmware -

qualcomm sdx24_firmware -

qualcomm sdx55_firmware -

qualcomm sm8150_firmware -

qualcomm sxr1130_firmware -